

Reflow oven, forced convection - FT 02

FT02 oven
has been created to re-flow solder paste and for curing
adhesives for prototyping.
The FT02 oven is compatible with high temperature alloys and
above all "lead free" ones thanks to its new heating system as
well as its built in electronics. The oven includes 10 memory
programs, information display LCD monitor, and a wide viewing
window to supervise the process. For a added safety the FT02
includes a double window with air circulation to avoid any
burning risk as well as a lock for the draw to avoid any
unwanted opening during re-flow.
FT02
Key features:
•
Complete view of the card thanks to a large window
• Compact model, but with a working area of 190 x 290 mm
• Heating through forced convection
• Temperature control by microprocessor
• Digital display of different parameters: temperature and time
• Easy programming for immediate control
• Safety: double window with air circulation, closing door
access