Special Application Products Ltd 

Tel:+44 (0)1473 327732     Fax: +44 (0)8701 400163     E-mail: sales@sapltd.co.uk

ESSEMTEC,    MPL3100 Micro Placer for high precision placements,     BGA & QFP devices.
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Close up of head assembly

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Placement of component

 

 

 

 

 

 

 

 

Expert MPL3100 Micro Placer.

For high precision placements.

MPL3100 System

 

The MPL3100 Micro placer allows precise mounting of special SMDs like BGAs, Flip Chip and Fine Pitch devices.

BGA out of alignment     BGA realigned

 

Motorised Z-axis for fast component placement, manual placement control and a split optic option for viewing opposite corners of the device.

Two colour LED illumination RED/GREEN ensuring good contrast between component and PCB pads.

Motorised camera zoom,  motorised focus, universal fixation for single and double sided PCBs.

Rigid construction and precise guides for accurate placement.

Max PCB size 300 x 450mm.

 

Data sheet

S.A.P Ltd providing solutions for :

Image Illumination - Inspection - Electronic Production 

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Last updated 29.03.2007

 

                                                              

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